Reliability of RoHS Compliant 2D and 3D IC Interconnects is popular PDF and ePub book, written by John H. Lau in 2010-10-22, it is a fantastic choice for those who relish reading online the Technology & Engineering genre. Let's immerse ourselves in this engaging Technology & Engineering book by exploring the summary and details provided below. Remember, Reliability of RoHS Compliant 2D and 3D IC Interconnects can be Read Online from any device for your convenience.
Reliability of RoHS Compliant 2D and 3D IC Interconnects Book PDF Summary
Proven 2D and 3D IC lead-free interconnect reliability techniques Reliability of RoHS-Compliant 2D and 3D IC Interconnects offers tested solutions to reliability problems in lead-free interconnects for PCB assembly, conventional IC packaging, 3D IC packaging, and 3D IC integration. This authoritative guide presents the latest cutting-edge reliability methods and data for electronic manufacturing services (EMS) on second-level interconnects, packaging assembly on first-level interconnects, and 3D IC integration on microbumps and through-silicon-via (TSV) interposers. Design reliable 2D and 3D IC interconnects in RoHS-compliant projects using the detailed information in this practical resource. Covers reliability of: 2D and 3D IC lead-free interconnects CCGA, PBGA, WLP, PQFP, flip-chip, lead-free SAC solder joints Lead-free (SACX) solder joints Low-temperature lead-free (SnBiAg) solder joints Solder joints with voids, high strain rate, and high ramp rate VCSEL and LED lead-free interconnects 3D LED and 3D MEMS with TSVs Chip-to-wafer (C2W) bonding and lead-free interconnects Wafer-to-wafer (W2W) bonding and lead-free interconnects 3D IC chip stacking with low-temperature bonding TSV interposers and lead-free interconnects Electromigration of lead-free microbumps for 3D IC integration
Detail Book of Reliability of RoHS Compliant 2D and 3D IC Interconnects PDF
- Author : John H. Lau
- Release : 22 October 2010
- Publisher : McGraw Hill Professional
- ISBN : 9780071753807
- Genre : Technology & Engineering
- Total Page : 640 pages
- Language : English
- PDF File Size : 10,8 Mb
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