Heterogeneous Integrations is popular PDF and ePub book, written by John H. Lau in 2019-04-03, it is a fantastic choice for those who relish reading online the Technology & Engineering genre. Let's immerse ourselves in this engaging Technology & Engineering book by exploring the summary and details provided below. Remember, Heterogeneous Integrations can be Read Online from any device for your convenience.
Heterogeneous Integrations Book PDF Summary
Heterogeneous integration uses packaging technology to integrate dissimilar chips, LED, MEMS, VCSEL, etc. from different fabless houses and with different functions and wafer sizes into a single system or subsystem. How are these dissimilar chips and optical components supposed to talk to each other? The answer is redistribution layers (RDLs). This book addresses the fabrication of RDLs for heterogeneous integrations, and especially focuses on RDLs on: A) organic substrates, B) silicon substrates (through-silicon via (TSV)-interposers), C) silicon substrates (bridges), D) fan-out substrates, and E) ASIC, memory, LED, MEMS, and VCSEL systems. The book offers a valuable asset for researchers, engineers, and graduate students in the fields of semiconductor packaging, materials sciences, mechanical engineering, electronic engineering, telecommunications, networking, etc.
Detail Book of Heterogeneous Integrations PDF
- Author : John H. Lau
- Release : 03 April 2019
- Publisher : Springer
- ISBN : 9789811372247
- Genre : Technology & Engineering
- Total Page : 368 pages
- Language : English
- PDF File Size : 11,9 Mb
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