Chiplet Design and Heterogeneous Integration Packaging is popular PDF and ePub book, written by John H. Lau in 2023-03-27, it is a fantastic choice for those who relish reading online the Technology & Engineering genre. Let's immerse ourselves in this engaging Technology & Engineering book by exploring the summary and details provided below. Remember, Chiplet Design and Heterogeneous Integration Packaging can be Read Online from any device for your convenience.
Chiplet Design and Heterogeneous Integration Packaging Book PDF Summary
The book focuses on the design, materials, process, fabrication, and reliability of chiplet design and heterogeneous integraton packaging. Both principles and engineering practice have been addressed, with more weight placed on engineering practice. This is achieved by providing in-depth study on a number of major topics such as chip partitioning, chip splitting, multiple system and heterogeneous integration with TSV-interposers, multiple system and heterogeneous integration with TSV-less interposers, chiplets lateral communication, system-in-package, fan-out wafer/panel-level packaging, and various Cu-Cu hybrid bonding. The book can benefit researchers, engineers, and graduate students in fields of electrical engineering, mechanical engineering, materials sciences, and industry engineering, etc.
Detail Book of Chiplet Design and Heterogeneous Integration Packaging PDF
- Author : John H. Lau
- Release : 27 March 2023
- Publisher : Springer Nature
- ISBN : 9789811999178
- Genre : Technology & Engineering
- Total Page : 542 pages
- Language : English
- PDF File Size : 19,6 Mb
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