3D Microelectronic Packaging is popular PDF and ePub book, written by Yan Li in 2020-11-23, it is a fantastic choice for those who relish reading online the Technology & Engineering genre. Let's immerse ourselves in this engaging Technology & Engineering book by exploring the summary and details provided below. Remember, 3D Microelectronic Packaging can be Read Online from any device for your convenience.
3D Microelectronic Packaging Book PDF Summary
This book offers a comprehensive reference guide for graduate students and professionals in both academia and industry, covering the fundamentals, architecture, processing details, and applications of 3D microelectronic packaging. It provides readers an in-depth understanding of the latest research and development findings regarding this key industry trend, including TSV, die processing, micro-bumps for LMI and MMI, direct bonding and advanced materials, as well as quality, reliability, fault isolation, and failure analysis for 3D microelectronic packages. Images, tables, and didactic schematics are used to illustrate and elaborate on the concepts discussed. Readers will gain a general grasp of 3D packaging, quality and reliability concerns, and common causes of failure, and will be introduced to developing areas and remaining gaps in 3D packaging that can help inspire future research and development.
Detail Book of 3D Microelectronic Packaging PDF
- Author : Yan Li
- Release : 23 November 2020
- Publisher : Springer Nature
- ISBN : 9789811570902
- Genre : Technology & Engineering
- Total Page : 629 pages
- Language : English
- PDF File Size : 17,7 Mb
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