3D IC Stacking Technology is popular PDF and ePub book, written by Banqiu Wu in 2011-10-14, it is a fantastic choice for those who relish reading online the Technology & Engineering genre. Let's immerse ourselves in this engaging Technology & Engineering book by exploring the summary and details provided below. Remember, 3D IC Stacking Technology can be Read Online from any device for your convenience.

3D IC Stacking Technology Book PDF Summary

The latest advances in three-dimensional integrated circuit stacking technology With a focus on industrial applications, 3D IC Stacking Technology offers comprehensive coverage of design, test, and fabrication processing methods for three-dimensional device integration. Each chapter in this authoritative guide is written by industry experts and details a separate fabrication step. Future industry applications and cutting-edge design potential are also discussed. This is an essential resource for semiconductor engineers and portable device designers. 3D IC Stacking Technology covers: High density through silicon stacking (TSS) technology Practical design ecosystem for heterogeneous 3D IC products Design automation and TCAD tool solutions for through silicon via (TSV)-based 3D IC stack Process integration for TSV manufacturing High-aspect-ratio silicon etch for TSV Dielectric deposition for TSV Barrier and seed deposition Copper electrodeposition for TSV Chemical mechanical polishing for TSV applications Temporary and permanent bonding Assembly and test aspects of TSV technology

Detail Book of 3D IC Stacking Technology PDF

3D IC Stacking Technology
  • Author : Banqiu Wu
  • Release : 14 October 2011
  • Publisher : McGraw Hill Professional
  • ISBN : 9780071741965
  • Genre : Technology & Engineering
  • Total Page : 543 pages
  • Language : English
  • PDF File Size : 16,5 Mb

If you're still pondering over how to secure a PDF or EPUB version of the book 3D IC Stacking Technology by Banqiu Wu, don't worry! All you have to do is click the 'Get Book' buttons below to kick off your Download or Read Online journey. Just a friendly reminder: we don't upload or host the files ourselves.

Get Book

3D IC Stacking Technology

3D IC Stacking Technology Author : Banqiu Wu,Ajay Kumar,Sesh Ramaswami
Publisher : McGraw Hill Professional
File Size : 55,5 Mb
Get Book
The latest advances in three-dimensional integrated circuit stacking technology With a focus on indu...

Three Dimensional System Integration

Three Dimensional System Integration Author : Antonis Papanikolaou,Dimitrios Soudris,Riko Radojcic
Publisher : Springer Science & Business Media
File Size : 31,8 Mb
Get Book
Three-dimensional (3D) integrated circuit (IC) stacking is the next big step in electronic system in...

Handbook of 3D Integration Volume 4

Handbook of 3D Integration  Volume 4 Author : Paul D. Franzon,Erik Jan Marinissen,Muhannad S. Bakir
Publisher : John Wiley & Sons
File Size : 38,7 Mb
Get Book
This fourth volume of the landmark handbook focuses on the design, testing, and thermal management o...

Wafer Level 3 D ICs Process Technology

Wafer Level 3 D ICs Process Technology Author : Chuan Seng Tan,Ronald J. Gutmann,L. Rafael Reif
Publisher : Springer Science & Business Media
File Size : 55,5 Mb
Get Book
This book focuses on foundry-based process technology that enables the fabrication of 3-D ICs. The c...

Three Dimensional Integrated Circuit Design

Three Dimensional Integrated Circuit Design Author : Yuan Xie,Jingsheng Jason Cong,Sachin Sapatnekar
Publisher : Springer Science & Business Media
File Size : 15,7 Mb
Get Book
We live in a time of great change. In the electronics world, the last several decades have seen unpr...

3D IC Integration and Packaging

3D IC Integration and Packaging Author : John H. Lau
Publisher : McGraw Hill Professional
File Size : 21,6 Mb
Get Book
A comprehensive guide to 3D IC integration and packaging technology3D IC Integration and Packaging f...

3D Stacked Chips

3D Stacked Chips Author : Ibrahim (Abe) M. Elfadel,Gerhard Fettweis
Publisher : Springer
File Size : 20,9 Mb
Get Book
This book explains for readers how 3D chip stacks promise to increase the level of on-chip integrati...