3D IC Stacking Technology is popular PDF and ePub book, written by Banqiu Wu in 2011-10-14, it is a fantastic choice for those who relish reading online the Technology & Engineering genre. Let's immerse ourselves in this engaging Technology & Engineering book by exploring the summary and details provided below. Remember, 3D IC Stacking Technology can be Read Online from any device for your convenience.
3D IC Stacking Technology Book PDF Summary
The latest advances in three-dimensional integrated circuit stacking technology With a focus on industrial applications, 3D IC Stacking Technology offers comprehensive coverage of design, test, and fabrication processing methods for three-dimensional device integration. Each chapter in this authoritative guide is written by industry experts and details a separate fabrication step. Future industry applications and cutting-edge design potential are also discussed. This is an essential resource for semiconductor engineers and portable device designers. 3D IC Stacking Technology covers: High density through silicon stacking (TSS) technology Practical design ecosystem for heterogeneous 3D IC products Design automation and TCAD tool solutions for through silicon via (TSV)-based 3D IC stack Process integration for TSV manufacturing High-aspect-ratio silicon etch for TSV Dielectric deposition for TSV Barrier and seed deposition Copper electrodeposition for TSV Chemical mechanical polishing for TSV applications Temporary and permanent bonding Assembly and test aspects of TSV technology
Detail Book of 3D IC Stacking Technology PDF
- Author : Banqiu Wu
- Release : 14 October 2011
- Publisher : McGraw Hill Professional
- ISBN : 9780071741965
- Genre : Technology & Engineering
- Total Page : 543 pages
- Language : English
- PDF File Size : 16,5 Mb
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