Wafer Level 3 D ICs Process Technology is popular PDF and ePub book, written by Chuan Seng Tan in 2009-06-29, it is a fantastic choice for those who relish reading online the Technology & Engineering genre. Let's immerse ourselves in this engaging Technology & Engineering book by exploring the summary and details provided below. Remember, Wafer Level 3 D ICs Process Technology can be Read Online from any device for your convenience.
Wafer Level 3 D ICs Process Technology Book PDF Summary
This book focuses on foundry-based process technology that enables the fabrication of 3-D ICs. The core of the book discusses the technology platform for pre-packaging wafer lever 3-D ICs. However, this book does not include a detailed discussion of 3-D ICs design and 3-D packaging. This is an edited book based on chapters contributed by various experts in the field of wafer-level 3-D ICs process technology. They are from academia, research labs and industry.
Detail Book of Wafer Level 3 D ICs Process Technology PDF
- Author : Chuan Seng Tan
- Release : 29 June 2009
- Publisher : Springer Science & Business Media
- ISBN : 9780387765341
- Genre : Technology & Engineering
- Total Page : 365 pages
- Language : English
- PDF File Size : 16,9 Mb
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