Wire Bonding in Microelectronics is popular PDF and ePub book, written by George Harman in 2009-06-05, it is a fantastic choice for those who relish reading online the Technology & Engineering genre. Let's immerse ourselves in this engaging Technology & Engineering book by exploring the summary and details provided below. Remember, Wire Bonding in Microelectronics can be Read Online from any device for your convenience.

Wire Bonding in Microelectronics Book PDF Summary

The Industry Standard Guide to Wire Bonding--Fully Updated The definitive resource on the critical process of connecting semiconductors with their packages, Wire Bonding in Microelectronics, Third Edition, has been thoroughly revised to help you meet the challenges of today's small-scale and fine-pitch microelectronics. This authoritative guide covers every aspect of designing, manufacturing, and evaluating wire bonds engineered with cutting-edge techniques. In addition to gaining a full grasp of bonding technology, you'll learn how to create reliable bonds at exceedingly high yields, test wire bonds, solve common bonding problems, implement molecular cleaning methods, and much more. COVERAGE INCLUDES: Ultrasonic bonding systems and technologies, including high-frequency systems Bonding wire metallurgy and characteristics, including copper wire Wire bond testing Gold-aluminum intermetallic compounds and other interface reactions Gold and nickel-based bond pad plating materials and problems Cleaning to improve bondability and reliability Mechanical problems in wire bonding High-yield, fifine-pitch, specialized-looping, soft-substrate, and extremetemperature wire bonds Copper, low-dielectric-constant (Cu/Lo-k) technology and problems Wire bonding process modeling and simulation CD includes all the book's full-color figures plus animations

Detail Book of Wire Bonding in Microelectronics PDF

Wire Bonding in Microelectronics
  • Author : George Harman
  • Release : 05 June 2009
  • Publisher : McGraw Hill Professional
  • ISBN : 9780071642651
  • Genre : Technology & Engineering
  • Total Page : 448 pages
  • Language : English
  • PDF File Size : 17,7 Mb

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Wire Bonding in Microelectronics

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