Solder Joint Reliability Prediction for Multiple Environments is popular PDF and ePub book, written by Andrew E. Perkins in 2008-12-16, it is a fantastic choice for those who relish reading online the Technology & Engineering genre. Let's immerse ourselves in this engaging Technology & Engineering book by exploring the summary and details provided below. Remember, Solder Joint Reliability Prediction for Multiple Environments can be Read Online from any device for your convenience.
Solder Joint Reliability Prediction for Multiple Environments Book PDF Summary
Solder Joint Reliability Prediction for Multiple Environments will provide industry engineers, graduate students and academic researchers, and reliability experts with insights and useful tools for evaluating solder joint reliability of ceramic area array electronic packages under multiple environments. The material presented here is not limited to ceramic area array packages only, it can also be used as a methodology for relating numerical simulations and experimental data into an easy-to-use equation that captures the essential information needed to predict solder joint reliability. Such a methodology is often needed to relate complex information in a simple manner to managers and non-experts in solder joint who work with computer server applications as well as for harsh environments such as those found in the defense, space, and automotive industries.
Detail Book of Solder Joint Reliability Prediction for Multiple Environments PDF
- Author : Andrew E. Perkins
- Release : 16 December 2008
- Publisher : Springer Science & Business Media
- ISBN : 9780387793948
- Genre : Technology & Engineering
- Total Page : 202 pages
- Language : English
- PDF File Size : 11,6 Mb
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