Semiconductor Advanced Packaging is popular PDF and ePub book, written by John H. Lau in 2021-05-17, it is a fantastic choice for those who relish reading online the Technology & Engineering genre. Let's immerse ourselves in this engaging Technology & Engineering book by exploring the summary and details provided below. Remember, Semiconductor Advanced Packaging can be Read Online from any device for your convenience.
Semiconductor Advanced Packaging Book PDF Summary
The book focuses on the design, materials, process, fabrication, and reliability of advanced semiconductor packaging components and systems. Both principles and engineering practice have been addressed, with more weight placed on engineering practice. This is achieved by providing in-depth study on a number of major topics such as system-in-package, fan-in wafer/panel-level chip-scale packages, fan-out wafer/panel-level packaging, 2D, 2.1D, 2.3D, 2.5D, and 3D IC integration, chiplets packaging, chip-to-wafer bonding, wafer-to-wafer bonding, hybrid bonding, and dielectric materials for high speed and frequency. The book can benefit researchers, engineers, and graduate students in fields of electrical engineering, mechanical engineering, materials sciences, and industry engineering, etc.
Detail Book of Semiconductor Advanced Packaging PDF
- Author : John H. Lau
- Release : 17 May 2021
- Publisher : Springer Nature
- ISBN : 9789811613760
- Genre : Technology & Engineering
- Total Page : 513 pages
- Language : English
- PDF File Size : 15,7 Mb
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