Manufacturing Challenges in Electronic Packaging is popular PDF and ePub book, written by Y.C. Lee in 2012-12-06, it is a fantastic choice for those who relish reading online the Science genre. Let's immerse ourselves in this engaging Science book by exploring the summary and details provided below. Remember, Manufacturing Challenges in Electronic Packaging can be Read Online from any device for your convenience.
Manufacturing Challenges in Electronic Packaging Book PDF Summary
About five to six years ago, the words 'packaging and manufacturing' started to be used together to emphasize that we have to make not only a few but thousands or even millions of packages which meet functional requirements. The aim of this book is to provide the much needed reviews and in-depth discussions on the advanced topics surrounding packaging and manufacturing. The first chapter gives a comprehensive review of manufacturing chal lenges in electronic packaging based on trends predicted by different resources. Almost all the functional specifications have already been met by technologies demonstrated in laboratories. However, it would take tremendous efforts to implement these technologies for mass production or flexible manufacturing. The topics crucial to this implementation are discussed in the following chapters: Chapter 2: Challenges in solder assembly technologies; Chapter 3: Testing and characterization; Chapter 4: Design for manufacture and assembly of electronic packages; Chapter 5: Process modeling, optimization and control in electronics manufacturing; and Chapter 6: Integrated manufacturing system for printed circuit board assembly. The electronics-based products are very competitive and becoming more and more application-specific. Their packages should fulfill cost, speed, power, weight, size, reliability and time-to-market requirements. More importantly, the packages should be manufacturable in mass or flexible production lines. These chapters are excellent references for professionals who need to meet the challenge through design and manufacturing improvements. This book will also introduce students to the critical issues for competitive design and manufacturing in electronic packaging.
Detail Book of Manufacturing Challenges in Electronic Packaging PDF
- Author : Y.C. Lee
- Release : 06 December 2012
- Publisher : Springer Science & Business Media
- ISBN : 9781461558033
- Genre : Science
- Total Page : 270 pages
- Language : English
- PDF File Size : 20,6 Mb
If you're still pondering over how to secure a PDF or EPUB version of the book Manufacturing Challenges in Electronic Packaging by Y.C. Lee, don't worry! All you have to do is click the 'Get Book' buttons below to kick off your Download or Read Online journey. Just a friendly reminder: we don't upload or host the files ourselves.