Foldable Flex and Thinned Silicon Multichip Packaging Technology is popular PDF and ePub book, written by John W. Balde in 2013-11-27, it is a fantastic choice for those who relish reading online the Technology & Engineering genre. Let's immerse ourselves in this engaging Technology & Engineering book by exploring the summary and details provided below. Remember, Foldable Flex and Thinned Silicon Multichip Packaging Technology can be Read Online from any device for your convenience.
Foldable Flex and Thinned Silicon Multichip Packaging Technology Book PDF Summary
Foldable Flex and Thinned Silicon Multichip Packaging Technology presents newly emerging methods used to make stacked chip packages in the so-called 2-1/2 D technology (3-D in physical format, but interconnected only through the circuits on folded flex). It is also being used in single chip packages where the thinness of the chips and the flex substrate made packages significantly thinner than through any other means.
Detail Book of Foldable Flex and Thinned Silicon Multichip Packaging Technology PDF
- Author : John W. Balde
- Release : 27 November 2013
- Publisher : Springer Science & Business Media
- ISBN : 9781461502319
- Genre : Technology & Engineering
- Total Page : 357 pages
- Language : English
- PDF File Size : 11,8 Mb
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