Fatigue Life Prediction of Solder Joints in Electronic Packages with Ansys is popular PDF and ePub book, written by Erdogan Madenci in 2012-12-06, it is a fantastic choice for those who relish reading online the Technology & Engineering genre. Let's immerse ourselves in this engaging Technology & Engineering book by exploring the summary and details provided below. Remember, Fatigue Life Prediction of Solder Joints in Electronic Packages with Ansys can be Read Online from any device for your convenience.
Fatigue Life Prediction of Solder Joints in Electronic Packages with Ansys Book PDF Summary
Fatigue Life Prediction of Solder Joints in Electronic Packages with ANSYS® describes the method in great detail starting from the theoretical basis. The reader is supplied with an add-on software package to ANSYS® that is designed for solder joint fatigue reliability analysis of electronic packages. Specific steps of the analysis method are discussed through examples without leaving any room for confusion. The add-on package along with the examples make it possible for an engineer with a working knowledge of ANSYS® to perform solder joint reliability analysis. Fatigue Life Prediction of Solder Joints in Electronic Packages with ANSYS® allows the engineers to conduct fatigue reliability analysis of solder joints in electronic packages.
Detail Book of Fatigue Life Prediction of Solder Joints in Electronic Packages with Ansys PDF
- Author : Erdogan Madenci
- Release : 06 December 2012
- Publisher : Springer Science & Business Media
- ISBN : 9781461502555
- Genre : Technology & Engineering
- Total Page : 201 pages
- Language : English
- PDF File Size : 16,9 Mb
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