Electronic Packaging Science and Technology is popular PDF and ePub book, written by King-Ning Tu in 2021-12-29, it is a fantastic choice for those who relish reading online the Science genre. Let's immerse ourselves in this engaging Science book by exploring the summary and details provided below. Remember, Electronic Packaging Science and Technology can be Read Online from any device for your convenience.

Electronic Packaging Science and Technology Book PDF Summary

Must-have reference on electronic packaging technology! The electronics industry is shifting towards system packaging technology due to the need for higher chip circuit density without increasing production costs. Electronic packaging, or circuit integration, is seen as a necessary strategy to achieve a performance growth of electronic circuitry in next-generation electronics. With the implementation of novel materials with specific and tunable electrical and magnetic properties, electronic packaging is highly attractive as a solution to achieve denser levels of circuit integration. The first part of the book gives an overview of electronic packaging and provides the reader with the fundamentals of the most important packaging techniques such as wire bonding, tap automatic bonding, flip chip solder joint bonding, microbump bonding, and low temperature direct Cu-to-Cu bonding. Part two consists of concepts of electronic circuit design and its role in low power devices, biomedical devices, and circuit integration. The last part of the book contains topics based on the science of electronic packaging and the reliability of packaging technology.

Detail Book of Electronic Packaging Science and Technology PDF

Electronic Packaging Science and Technology
  • Author : King-Ning Tu
  • Release : 29 December 2021
  • Publisher : John Wiley & Sons
  • ISBN : 9781119418313
  • Genre : Science
  • Total Page : 340 pages
  • Language : English
  • PDF File Size : 7,5 Mb

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