Electronic Packaging Interconnect Technology is popular PDF and ePub book, written by Kazuhiro Nogita in 2018-04-13, it is a fantastic choice for those who relish reading online the Technology & Engineering genre. Let's immerse ourselves in this engaging Technology & Engineering book by exploring the summary and details provided below. Remember, Electronic Packaging Interconnect Technology can be Read Online from any device for your convenience.
Electronic Packaging Interconnect Technology Book PDF Summary
This volume presents for readers some selected papers from the 2017 Electronic Packaging Interconnect Technology Symposium (EPITS 2017, Fukuoka, Japan, November 1-2, 2017) and covers many aspects of topics such as implementing the Restriction of Hazardous Substances (ROHS), emerging interconnect materials and technologies, solders for interconnection at chip and package levels, stress-migration and mechanical properties of solder connections, research of properties of other materials and development of chemical technologies. The editors hope that this volume will provide the reader with a broad overview of the latest advances in the field of Electronic Packaging Interconnect Technology, and that will be a valuable reference source for further research.
Detail Book of Electronic Packaging Interconnect Technology PDF
- Author : Kazuhiro Nogita
- Release : 13 April 2018
- Publisher : Trans Tech Publications Ltd
- ISBN : 9783035733242
- Genre : Technology & Engineering
- Total Page : 210 pages
- Language : English
- PDF File Size : 12,9 Mb
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