Electromigration Modeling at Circuit Layout Level is popular PDF and ePub book, written by Cher Ming Tan in 2013-03-16, it is a fantastic choice for those who relish reading online the Technology & Engineering genre. Let's immerse ourselves in this engaging Technology & Engineering book by exploring the summary and details provided below. Remember, Electromigration Modeling at Circuit Layout Level can be Read Online from any device for your convenience.
Electromigration Modeling at Circuit Layout Level Book PDF Summary
Integrated circuit (IC) reliability is of increasing concern in present-day IC technology where the interconnect failures significantly increases the failure rate for ICs with decreasing interconnect dimension and increasing number of interconnect levels. Electromigration (EM) of interconnects has now become the dominant failure mechanism that determines the circuit reliability. This brief addresses the readers to the necessity of 3D real circuit modelling in order to evaluate the EM of interconnect system in ICs, and how they can create such models for their own applications. A 3-dimensional (3D) electro-thermo-structural model as opposed to the conventional current density based 2-dimensional (2D) models is presented at circuit-layout level.
Detail Book of Electromigration Modeling at Circuit Layout Level PDF
- Author : Cher Ming Tan
- Release : 16 March 2013
- Publisher : Springer Science & Business Media
- ISBN : 9789814451215
- Genre : Technology & Engineering
- Total Page : 111 pages
- Language : English
- PDF File Size : 10,9 Mb
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