Design And Modeling For 3d Ics And Interposers is popular PDF and ePub book, written by Madhavan Swaminathan in 2013-11-05, it is a fantastic choice for those who relish reading online the Technology & Engineering genre. Let's immerse ourselves in this engaging Technology & Engineering book by exploring the summary and details provided below. Remember, Design And Modeling For 3d Ics And Interposers can be Read Online from any device for your convenience.
Design And Modeling For 3d Ics And Interposers Book PDF Summary
3D Integration is being touted as the next semiconductor revolution. This book provides a comprehensive coverage on the design and modeling aspects of 3D integration, in particularly, focus on its electrical behavior. Looking from the perspective the Silicon Via (TSV) and Glass Via (TGV) technology, the book introduces 3DICs and Interposers as a technology, and presents its application in numerical modeling, signal integrity, power integrity and thermal integrity. The authors underscored the potential of this technology in design exchange formats and power distribution.
Detail Book of Design And Modeling For 3d Ics And Interposers PDF
- Author : Madhavan Swaminathan
- Release : 05 November 2013
- Publisher : World Scientific
- ISBN : 9789814508612
- Genre : Technology & Engineering
- Total Page : 379 pages
- Language : English
- PDF File Size : 19,5 Mb
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