Integrated Modeling of Chemical Mechanical Planarization for Sub Micron IC Fabrication is popular PDF and ePub book, written by Jianfeng Luo in 2013-03-09, it is a fantastic choice for those who relish reading online the Science genre. Let's immerse ourselves in this engaging Science book by exploring the summary and details provided below. Remember, Integrated Modeling of Chemical Mechanical Planarization for Sub Micron IC Fabrication can be Read Online from any device for your convenience.
Integrated Modeling of Chemical Mechanical Planarization for Sub Micron IC Fabrication Book PDF Summary
Chemical mechanical planarization, or chemical mechanical polishing as it is simultaneously referred to, has emerged as one of the critical processes in semiconductor manufacturing and in the production of other related products and devices, MEMS for example. Since its introduction some 15+ years ago CMP, as it is commonly called, has moved steadily into new and challenging areas of semiconductor fabrication. Demands on it for consistent, efficient and cost-effective processing have been steady. This has continued in the face of steadily decreasing feature sizes, impressive increases in wafer size and a continuing array of new materials used in devices today. There are a number of excellent existing references and monographs on CMP in circulation and we defer to them for detailed background information. They are cited in the text. Our focus here is on the important area of process mod els which have not kept pace with the tremendous expansion of applications of CMP. Preston's equation is a valuable start but represents none of the subtleties of the process. Specifically, we refer to the development of models with sufficient detail to allow the evaluation and tradeoff of process inputs and parameters to assess impact on quality or quantity of production. We call that an "integrated model" and, more specifically, we include the important role of the mechanical elements of the process.
Detail Book of Integrated Modeling of Chemical Mechanical Planarization for Sub Micron IC Fabrication PDF
- Author : Jianfeng Luo
- Release : 09 March 2013
- Publisher : Springer Science & Business Media
- ISBN : 9783662079287
- Genre : Science
- Total Page : 327 pages
- Language : English
- PDF File Size : 16,8 Mb
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