Hybrid Assemblies and Multichip Modules is popular PDF and ePub book, written by Fred W. Kear in 2020-07-24, it is a fantastic choice for those who relish reading online the Technology & Engineering genre. Let's immerse ourselves in this engaging Technology & Engineering book by exploring the summary and details provided below. Remember, Hybrid Assemblies and Multichip Modules can be Read Online from any device for your convenience.
Hybrid Assemblies and Multichip Modules Book PDF Summary
Providing a description of design considerations from the user's viewpoint, this detailed reference discusses the materials used in manufacturing hybrid assemblies and multichip modules - illustrating how these products are created for a wide range of applications.;Examining the current state of hybrid assembly technology, Hybrid Assemblies and Multichip Modules: provides a thorough overview of substrate materials and metals used for conductors, addressing multilayer materials and overglazes; explicates design considerations such as circuit layout, component placement, thermal management and interface problems; clarifies the manufacturing techniques used for multi-layer thick-film circuits and multilayer substrates; and explains soldering and other attachment methods for discrete components.;Focusing primarily on electronic assemblies that use ceramic substrates, Hybrid Assemblies and Multichip Modules should serve as a comprehensive resource for manufacturing, electrical and electronics, and automotive engineers; manufacturing managers; hybrid assembly designers; hybrid assembly users; printed circuit designers, fabricators and users; and graduate-level students in manufacturing engineering and electronic packaging courses.
Detail Book of Hybrid Assemblies and Multichip Modules PDF
- Author : Fred W. Kear
- Release : 24 July 2020
- Publisher : CRC Press
- ISBN : 9781000147803
- Genre : Technology & Engineering
- Total Page : 298 pages
- Language : English
- PDF File Size : 16,5 Mb
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