High Performance Design Automation For Multi chip Modules And Packages is popular PDF and ePub book, written by Jun Dong Cho in 1996-06-12, it is a fantastic choice for those who relish reading online the Technology & Engineering genre. Let's immerse ourselves in this engaging Technology & Engineering book by exploring the summary and details provided below. Remember, High Performance Design Automation For Multi chip Modules And Packages can be Read Online from any device for your convenience.
High Performance Design Automation For Multi chip Modules And Packages Book PDF Summary
Today's electronics industry requires new design automation methodologies that allow designers to incorporate high performance integrated circuits into smaller packaging. The aim of this book is to present current and future techniques and algorithms of high performance multichip modules (MCMs) and other packaging methodologies. Innovative technical papers in this book cover design optimization and physical partitioning; global routing/multi-layer assignment; timing-driven interconnection design (timing models, clock and power design); crosstalk, reflection, and simultaneous switching noise minimization; yield optimization; defect area minimization; low-power physical layout; and design methodologies. Two tutorial reviews review some of the most significant algorithms previously developed for the placement/partitioning, and signal integrity issues, respectively. The remaining articles review the trend of prime design automation algorithms to solve the above eight problems which arise in MCMs and other packages.
Detail Book of High Performance Design Automation For Multi chip Modules And Packages PDF
- Author : Jun Dong Cho
- Release : 12 June 1996
- Publisher : World Scientific
- ISBN : 9789814500265
- Genre : Technology & Engineering
- Total Page : 266 pages
- Language : English
- PDF File Size : 13,9 Mb
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