Die stacking Architecture is popular PDF and ePub book, written by Yuan Xie in 2022-05-31, it is a fantastic choice for those who relish reading online the Technology & Engineering genre. Let's immerse ourselves in this engaging Technology & Engineering book by exploring the summary and details provided below. Remember, Die stacking Architecture can be Read Online from any device for your convenience.
Die stacking Architecture Book PDF Summary
The emerging three-dimensional (3D) chip architectures, with their intrinsic capability of reducing the wire length, promise attractive solutions to reduce the delay of interconnects in future microprocessors. 3D memory stacking enables much higher memory bandwidth for future chip-multiprocessor design, mitigating the "memory wall" problem. In addition, heterogenous integration enabled by 3D technology can also result in innovative designs for future microprocessors. This book first provides a brief introduction to this emerging technology, and then presents a variety of approaches to designing future 3D microprocessor systems, by leveraging the benefits of low latency, high bandwidth, and heterogeneous integration capability which are offered by 3D technology.
Detail Book of Die stacking Architecture PDF
- Author : Yuan Xie
- Release : 31 May 2022
- Publisher : Springer Nature
- ISBN : 9783031017476
- Genre : Technology & Engineering
- Total Page : 113 pages
- Language : English
- PDF File Size : 21,9 Mb
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