Arbitrary Modeling of TSVs for 3D Integrated Circuits is popular PDF and ePub book, written by Khaled Salah in 2014-08-21, it is a fantastic choice for those who relish reading online the Technology & Engineering genre. Let's immerse ourselves in this engaging Technology & Engineering book by exploring the summary and details provided below. Remember, Arbitrary Modeling of TSVs for 3D Integrated Circuits can be Read Online from any device for your convenience.
Arbitrary Modeling of TSVs for 3D Integrated Circuits Book PDF Summary
This book presents a wide-band and technology independent, SPICE-compatible RLC model for through-silicon vias (TSVs) in 3D integrated circuits. This model accounts for a variety of effects, including skin effect, depletion capacitance and nearby contact effects. Readers will benefit from in-depth coverage of concepts and technology such as 3D integration, Macro modeling, dimensional analysis and compact modeling, as well as closed form equations for the through silicon via parasitics. Concepts covered are demonstrated by using TSVs in applications such as a spiral inductor and inductive-based communication system and bandpass filtering.
Detail Book of Arbitrary Modeling of TSVs for 3D Integrated Circuits PDF
- Author : Khaled Salah
- Release : 21 August 2014
- Publisher : Springer
- ISBN : 9783319076119
- Genre : Technology & Engineering
- Total Page : 181 pages
- Language : English
- PDF File Size : 8,8 Mb
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