Advanced Flip Chip Packaging is popular PDF and ePub book, written by Ho-Ming Tong in 2013-03-20, it is a fantastic choice for those who relish reading online the Technology & Engineering genre. Let's immerse ourselves in this engaging Technology & Engineering book by exploring the summary and details provided below. Remember, Advanced Flip Chip Packaging can be Read Online from any device for your convenience.
Advanced Flip Chip Packaging Book PDF Summary
Advanced Flip Chip Packaging presents past, present and future advances and trends in areas such as substrate technology, material development, and assembly processes. Flip chip packaging is now in widespread use in computing, communications, consumer and automotive electronics, and the demand for flip chip technology is continuing to grow in order to meet the need for products that offer better performance, are smaller, and are environmentally sustainable.
Detail Book of Advanced Flip Chip Packaging PDF
- Author : Ho-Ming Tong
- Release : 20 March 2013
- Publisher : Springer Science & Business Media
- ISBN : 9781441957689
- Genre : Technology & Engineering
- Total Page : 562 pages
- Language : English
- PDF File Size : 16,5 Mb
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